AMA, Agricultural Mechanization in Asia, Africa and Latin America
AMA, Agricultural Mechanization in Asia, Africa and Latin America (AMA) (issn: 00845841) is a peer reviewed journal first published online after indexing scopus in 1982. AMA is published by Farm Machinery Industrial Research Corp and Shin-Norinsha Co. AMA publishes every subjects of general engineering and agricultural engineering.
WOS Indexed (2025)
27 Nov 2025 (Vol - 56 , Issue- 11 )
30 Nov 2025 (Vol - 56 , Issue 11 )
Aim and Scope :
AMA, Agricultural Mechanization in Asia, Africa and Latin America
AMA, Agricultural Mechanization in Asia, Africa and Latin America (ISSN: 00845841) is a peer-reviewed journal. The journal covers Agricultural and Biological Sciences and all sort of engineering topic. the journal's scopes are in the following fields but not limited to:
Agricultural and Biological Sciences
Electrical Engineering and Telecommunication
Electronic Engineering
Computer Science & Engineering
Civil and architectural engineering
Mechanical and Materials Engineering
Transportation Engineering
Industrial Engineering
Industrial and Commercial Design
Information Engineering
Chemical Engineering
Food Engineering
Effect of Input Parameters on Material Removal Speed when EDM 90CrSi Steel with Graphite Electrodes
This paper introduces an optimization study when electrical discharge machining (EDM) cylindrical parts made of 90CrSi tool steel. The objective of this optimization study is to achieve the maximum material removal speed (MRS). This is an experimental study with the use of the Taguchi method in Minitab 19 software to design the experiment and analyze its results. The impact of the input process parameters, including the pulse on time, the pulse off time, the servo current, and the servo voltage on the MRS was evaluated. In addition, optimal EDM parameters for the maximum MRS were found.
INFLUENCES OF FEED TO WIRE SPEED RATIO ON ABRASIVE CUTTING MECHANISM AND THE GENERATION OF SLICED SURFACE IN DIAMOND WIRE SAWING OF SILICON CRYSTAL
Wire sawing of crystal silicon is one of the most important manufacturing methods for wafer production in photovoltaic and semiconductor industry. Currently, thin wires with smaller wire core, finer abrasive and larger abrasive density are employed in industrial wire sawing to reduce the material kerf loss and increase the quality of wafer surface. This study investigates the influences of feed to wire speed to rate ratio to the cutting depth and material removal at abrasive level when using this type of wires. The model of ingot section profile has been developed allowing the numerical simulations of wire sawing process with different processing and wire parameters. Results show that the brittle cutting always takes place in the wire sawing of silicon. The volume of material removed by brittle cutting could exceed 90% at the bottom cutting zone of the wire even though the percentage of brittle cutting abrasive is less than 20%. In contrast, material removal at the side cutting zone could be pure ductile at low value of feed to wire speed ratio. The comparison of cutting depth distribution in the cutting zone shows a significantly difference in abrasive cutting behaviors. While pure ductile cutting takes place at the side, the process efficiency could be maintained by a number of brittle cutting abrasives at the bottom cutting zone. The results are suitable for determining process parameters for achieving a high material removal rate in sawing direction while keeping the damaged zone in the near-surface region of the wafers as small as possible
ABRASIVE CUTTING DEPTH AND MATERIAL REMOVAL IN WIRE SAWING OF SILICON USING THIN DIAMOND WIRES
Thin diamond wires with smaller steel core, finer abrasives and higher abrasive density are being developed for the wire sawing process in the production of silicon in semiconductor and photovoltaic industry. The use of thinner wires not only increases process efficiency by reducing kerf loss but also improves surface quality by enhancing ductile cutting mechanism in cutting zone. In this paper, a model that considers wire and process parameters is developed to study the cutting depth of abrasives and cutting behaviors during wire sawing process of silicon using thin wires. Simulation results show that when using thin wire with diameter of 100 µm, abrasive size ranging from 40 to 60 µm and abrasive density of 650 pcs/mm2, average cutting depth of abrasives is 0.22 µm and 90.7% of abrasives cutting in ductile mode. It is concluded that material removal shifts from brittle cutting dominance to ductile cutting dominance with the use of thinner wire which results in better sliced surface quality. The proposed model is useful in analyzing of optimal parameters for the wire sawing of silicon wafers.
Effect of EDM Parameters on Surface Roughness when Machining 90CrSi Steel with Graphite Electrodes
This paper presents the results of a study on optimizing Electrical discharge machining (EDM) when machining cylindrical parts made of 90CrSi tool steel to achieve the minimum surface roughness (SR). To do that, an experiment was performed. The Taguchi method in Minitab 19 software was used to design the experiment and analyze its results. The effects of the input process parameters, including the pulse on time, the pulse off time, the servo current, and the servo voltage on the surface roughness were investigated. Furthermore, optimal EDM parameters for minimal SR was proposed.
Neural Network Fuzzy Sliding Mode Control Design of Camellia Fruit Picking Manipulator
Aiming at the positioning and clamping control problem of the push-and-swing camellia fruit picking machine, the dynamic model of the push-and-swing camellia fruit picking manipulator and the dynamic model of the hydraulic servo actuator were established. The state space equation of the control object was deduced based on these two dynamic models. Based on the traditional sliding mode variable structure control (abbreviated as SMVS control in this paper), the RBF neural network fuzzy sliding mode variable structure adaptive controller (abbreviated as NNFSMVS controller in this paper) is designed, which was proved to be stable by Lyapunov's theorem. Then the manipulator control system was simulated with MATLAB/Simulink, and a SMVS controller was used to contrast with it. The simulation results show that the NNFSMVS controller has a faster response speed, and its maximum trajectory tracking error is 0.0026rad/mm smaller than the maximum trajectory tracking error of the SMVS controller, and it can significantly reduce the control system chattering. Finally, after field experiments, the control response speed of the NNFSMVS controller is between 0.8-1s, which can meet the positioning and clamping requirements of the camellia fruit picking machine.